Altair Semiconductor Chipset Powers Softbank Mobile's 110Mbps 4G Demonstration

FourGeeT LTE Chipset by Altair Breaks Its Second Speed Record in Two Months

Altair Semiconductor (www.altair-semi.com), the world's leading developer of ultra-low power, small footprint and high performance 4G LTE chipsets, announced today that its FourGeeT LTE chipset, integrated in a commercial USB dongle, was used in Softbank Mobile's 4G press conference AXGP demonstration conducted in Japan on September 29. AXGP stands for "Advanced eXtended Global Platform", and is a Japanese 4G standard that is fully compliant with the TD-LTE specification.

In August, Altair announced that its TD-LTE chipset, integrated in a commercial USB dongle, achieved download speeds of more than 100Mbps in a live over-the-air demonstration.

"Altair's LTE chipset is an industry benchmark - both when it comes to performance and maturity," said Eran Eshed, Co-Founder and VP of Marketing and Business Development at Altair Semiconductor. "We are pleased that our market-ready FourGeeT LTE chipset, integrated in a fully commercialized USB dongle device, was selected by Softbank to power the world's fastest 4G TDD network, and we look forward to continue demonstrating the power of our chipsets in 4G networks around the world."

Altair is shipping one of the first commercial TDD/FDD LTE chipsets in the market today and has established a strong leadership position in the emerging TD-LTE market. Recently, Altair achieved qualification by China's Ministry of Industry and Information Technology (MIIT), officially approving it for use in LTE networks in China. The chipset has been selected by more than 15 ODM/OEM vendors globally and has been in mass production for over a year.