According to a new market research report "Thin Wafer Market by Wafer Size (125mm, 200mm, 300mm), Process (Temporary Bonding & Debonding, Carrier-less/Taiko Process), Application (MEMS, CMOS Image Sensor, Memory, RF Devices, LED, Interposer, Logic), and Region - Global Trend and Forecast to 2022", the thin wafer market was valued USD 6.76 Billion in 2015 and estimated to reach USD 9.17 Billion by 2022, at a CAGR of 3.7% between 2016 and 2022. Factors such as growth in the semiconductor industry, reduction in the size of electronic devices, growing mobile and consumer electronic markets, and high amount of material saving are key drivers for the growth of the thin wafer market. Moreover, the growing IC industry in China and high adoption of portable devices provide a huge opportunity for further growth of this market.
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Browse 41 market data tables and 53 figures spread through 123 pages and in-depth TOC on "Thin Wafer Market - Global Trend and Forecast to 2022"
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300mm wafer expected to lead the thin wafer market:
The 300mm wafer is widely used in the manufacturing of semiconductor devices due to its high production capacity among all other wafers. This wafer size is expected to exhibit highest growth during the forecast period. It offers the ability to manufacture a large number of devices in a single batch. This is one of the reasons companies are developing their semiconductor devices on this wafer.
The market for application in LEDs expected to grow at the highest CAGR between 2016 and 2022
The LED application is expected to grow at the highest CAGR between 2016 and 2022. The miniaturization of electronic devices has positively impacted the thin wafer market growth. A thin wafer offers high conductivity and electrical benefits for LED chips. These benefits drive the thin wafer market for LEDs.
APAC expected to hold the largest market share and grow at a high CAGR during forecast period
APAC accounted for the largest share in the thin wafer market in 2014; this market is expected to grow at the highest CAGR between 2016 and 2022. The growth is attributed to increasing industrialization and urbanization in the region. Further, the increasing semiconductor manufacturing capacity in countries such as China, Taiwan, and South Korea are key factors responsible for the increasing adoption of the thin wafer market.
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Major players operating in this market are LG Siltronic, Inc. (South Korea), Shin-Etsu Chemical Co. (Japan), Siltronic AG (Germany), Sumco Corporation (Japan), Sunedision Semiconductor Ltd. (U.S.), SUSS Microtec AG (Germany), Lintec Corporation (Japan), Disco Corporation (Japan), 3M (U.S.), Applied Materials, Inc. (U.S.), Nissan Chemical Corporation (Japan), Synova (Switzerland), EV Group (U.S.), Brewer Science, Inc. (U.S.), and Ulvac GmbH (Germany).
This research report categorizes the global thin
wafer market based on wafer size, application, and region. This report
describes the drivers, restraints, opportunities, and challenges with
respect to the thin wafer market. The Porter’s five forces analysis has
been included in the report with a description of each of its forces and
their respective impact on the thin wafer market.
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