According to a new market research report “Smart Packaging Market by Technology (Active, Intelligent, and MAP), Industry Vertical (Food & Beverages, Automotive, Healthcare, Personal Care, and Others) & Geography - Global Forecast to 2020”, the smart packaging market size is expected to reach $39.7 Billion, growing at a CAGR of 4.8% from 2014 to 2020.
Browse 72 market data tables and 72 figures spread through 155 pages and in-depth TOC on “Smart Packaging Market - Global Forecast to 2020"
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The smart packaging market is driven by the increased demand for improved health, safety, and authenticity. Smart packaging is defined as a combination of active, intelligent, and modified atmosphere packaging techniques, specifically designed to increase and monitor shelf life. It is where components have been added in the packaging material or packaging headspace in order to improve the performance of the package system.
The report also covers the major trends being followed in the smart packaging market, along with market dynamics, Porters analysis, and value chain analysis. The market dynamics are categorized under four headers, namely drivers, restraints, opportunities, and challenges. Market related forecasts have been done using these market dynamics.
The report also includes the detailed profiles of various companies currently active in this market. In addition to the company profiles, the report also provides a competitive landscape (CL) of the key players in the market. The CL section covers market share analysis, mergers and acquisitions, collaborations, partnerships, new product developments, and other key growth strategies of each player.
Apart from the market statistics, the report also includes qualitative analysis such as value chain with detailed process flow diagrams; market dynamics such as drivers, restraints, and opportunities; winning imperatives; and industry trends for the overall smart sensor market.
Some of the key players in the industry that have been covered in this report are 3M (U.S.), TempTime Corporation (U.S.), PakSense (U.S.), American Thermal Instruments (U.S.), Avery Dennison (U.S.), R.R. Donnelly Sons & Company (U.S.), BASF SE (Germany), International Paper (U.S.), Stora Enso (Finland), Thin Film Electronics ASA (Norway), Huhtamaki Group (Finland), and Smartrac N.V. (The Netherlands), among others.
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