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In-Depth Study on Global Bonding Wire packaging material market 2016-2020

Report : Global Bonding Wire packaging material market 2016-2020 is a new market research publication announced by Reportstack.

Report Outline: Bonding wires can be made up of gold, copper, silver, and aluminum. The diameter of the wire ranges from 15 micrometer to several hundred micro-meters for high-powered applications. Bonding wires made of gold dominated the bonding wire packaging material market for decades. However, the industry is shifting toward the use of copper and other materials, which include silver as the new addition since 2010. The market share of gold in terms of volume used for bonding wire was more than 95% in 2007 and dropped to 40% in 2015 due to rising prices of gold. The remaining volume was replaced by copper and silver in 2015.

For detailed report with TOC, please click here ​Global Bonding Wire packaging material market 2016-2020.

Market Growth: The global bonding wire packaging material market will generate revenues of USD 2.9 billion in 2020.

Key vendors: 
• TANAKA Precious Metals
• Heraeus Deutschland
• California Fine Wire
• MK Electron

Other prominent vendors: 
• AMETEK
• EMMTECH
• Inseto
• Palomar Technologies
• RED Micro Wire
• SHINKAWA
• Sumitomo Metal Mining
• Tatsuta Electric Wire & Cable

Regions Covered:

• APAC
• Europe
• North America
• ROW

Companies Mentioned:

TANAKA Precious Metals, Heraeus Deutschland, California Fine Wire, MK Electron, AMETEK, EMMTECH, Inseto, Palomar Technologies, RED Micro Wire, SHINKAWA, Sumitomo Metal Mining, Tatsuta Electric Wire & Cable.

Contact:

Debora White

Manager - Marketing

debora@reportstack.com

Ph: +1-888-789-6604

Reportstack Market Research

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