Global IGBT-based Power Module Market 2014-2018

Reportstack Announces the Publication of its Research Report - Global IGBT-based Power Module Market 2014-2018. The following companies are the key players in Global IGBT-based Power Module Market: Fuji Electric Co. Ltd., Infineon Technologies AG, Mitsubishi Electric Corp., Semikron International GmbH, ABB Ltd., FairchildSemiconductor International Inc., NXP Semiconductors N.V., Renesas Electronics Corp., STMicroelectronics N.V., Toshiba Corp.

“There is an increasing focus on IGBT chip optimization because of the growing need for higher power density, higher power output, and increased thermal resistivity. IGBTs are used extensively in various types of power electronic devices because IGBT chips are compact in design, small in size, and have high reliability, which improves functionality. Several market vendors are also investing heavily in R&D to manufacture optimized chips to increase the operational efficiency of IGBT-based power modules.”

According to the report, the need to generate electrical energy from renewable energy sources is rapidly growing. It is estimated that global energy consumption will increase by over 60 percent by 2030, which is also expected to enhance the adoption of IGBT-based power modules in wind turbines. These modules are used in wind turbine converters as well as in grid converters and inverters in solar panels to increase power efficiency and switching speed. The growing need for increased thermal capacity and power cycling capacity is also playing a significant role in driving the adoption of IGBT-based power modules for wind turbine applications. 

Further, the report states that IGBT-based power modules have higher power density than MOSFETs and they can manage power upto 1,000A. This increases the cost of IGBT-based power modules on an ampere per dollar basis. The high cost of IGBT-based power modules deters their use in applications such as welding equipment, low-voltage motor control, and UPS. Several cost-sensitive SMEs that manufacture electronic devices also find it difficult to adopt these modules.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors. For further information on this report, please visit