Technological Co-Integrations Spurring Growth Opportunities in the Global 3D IC Market

Reportstack has announced a new market research report on the Global 3D IC Market 2014-2018.   One of the major trends in the market is the multi-chip packaging of 3D integrated circuits, which allows the incorporation of numerous transistors. Multi-chip packaging has revolutionized the packaging method used for ICs.

A 3D IC is an IC with multiple layers of active electronic components integrated both vertically and horizontally, into a single circuit. They are the perfect solution for meeting the growing demand to minimize the size and reduce the cost of products in the consumer electronics segment. “Co-integration of techniques has enabled vendors to introduce the latest innovations,” . “Vendors are striving to develop various other innovations where 3D IC has high co-integration with other technologies.”

To define the market conditions in the next 3-4 years, the analysts have conducted in-depth analysis of the impact of market drivers, challenges and trends featuring data on product segmentations, vendor shares, growth rate by revenue and an evaluation of the different buying criteria in the order of importance. 

To access full report with TOC, please visit Global 3D IC Market 2014-2018.