The Report “Power Electronics Market by Substrate Wafer Technology (GaN, SiC, and Others), Devices (Power IC, Power Module & Power Discrete), Applications, and Geography – Analysis & Forecast to 2014 – 2020″ is now available at RnRMarketResearch.com.
Power electronics technology has achieved a significant prime of life after a number of decades of dynamic evolution of power semiconductor devices, converters, PWM techniques, machines, motor drives, advanced control systems, and simulation techniques. The impact of this industry is felt not only on theglobal industrialization and general energy systems, but also onenergy conservation, renewable energy systems, and electric/hybrid vehicles; as well as in the medical field related applications.
The basic principle of power electronics is based on the conversion and control of electrical power with the help of power semiconductor devices. These power devices operate as a switch and, therefore, the efficiency of power electronics systems reaches as high as 99%. The advancement in technology has significantly reduced the cost of power electronics over the years. Also, the size of electronic devices has become smaller and the performance of these devices has shown a tremendous amount of improvement. The power electronics applications are proliferating in ICT, industrial, power, aerospace & defense, automotive, medical, and transportation systems.
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The power electronics market has left its footprints globally; and the major market for the power electronics ecosystem in semiconductors lies in APAC countries such as South Korea, Japan, Taiwan, China, and others’ that include India, Malaysia and Singapore. The other segments such as the Americas, Europe, and ROW follow the APAC in terms of the power electronics market. This report gives an in depth analysis of the major drivers, restraints, and opportunities for the power electronics market. Also, a competitive landscape of the major players in the power electronics ecosystem is very well illustrated.
Major players discussed in the power electronics market report include Texas Instruments Inc. (U.S), Vishay Intertechnology Inc. (U.S), Infineon Technologies AG (Germany), NXP Semiconductors (U.S), Fairchild Semiconductor (U.S), Microsemi Corp. (U.S), Toshiba Corp. (Japan), Hitachi Co., Ltd (Japan), and Mitsubishi Electric Corp. (Japan).
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This report focuseson giving a detail-view of the complete power electronics industry with respect to the device market, with detailed market segmentations; combined with a qualitative analysis ofeach and every aspect of the classifications done by the substrate wafer technology, devices, characteristics, products, application verticals (sectors), sub- applications, and geographical distribution. All the numbers, both -with regards to the revenue andvolume, at every level of detail, are forecasted till 2020 to give a glimpse of the potential revenue base in this market.
4.1 Geography Life-Cycle Of Power Electronics Market
4.1.1 Forecast Of Market Conditions For Different Regions
4.2 Growth Strategy Matrix (Ansoff Matrix)
4.2.1 Market Development
18.104.22.168 U.K., And Russia Can Be The Potential Markets In The Days To Come
22.214.171.124 Forward Integration To Be The Smartest Strategy For Wafer Players
4.2.3 Market Penetration
126.96.36.199 Japan And China Are The Most Flourishing Geographies For Existing Players As Well As New Entrants
4.2.4 Product Development
188.8.131.52 Product Development In New Markets Would Be The Game Changing Strategy For Existing As Well As New Market Entrants
4.3 Supply & Demand-Side Factor Analysis
4.4 Market Investment Analysis
4.4.1 Major Barriers For Investment In Global Market
4.4.2 Major Pro-Factors For Investment In Global Market
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12.1 Renesas Electronics Corporation
12.2 Abb Ltd
12.4 Microsemi Corporation
12.5 Freescale Semiconductor, Inc.
12.6 Taiwan Semiconductors Manufacturing Company Limited (Tsmc)
12.7 Texas Instruments, Inc.
12.8 Stmicroelectronics Nv
12.9 Rockwell Automation, Inc.
For further information on “Power Electronics Market by Substrate Wafer Technology (GaN, SiC, and Others), Devices (Power IC, Power Module & Power Discrete), Applications, and Geography – Analysis & Forecast to 2014 – 2020” report, contact firstname.lastname@example.org / Call +1 888 391 5441.