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System in Package Technology Market expected to worth $18.10 Billion by 2020

According to a new market research report "System in Package (SIP) Market by Technology (2D, 2.5D & 3D), by Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond), Applications (Communications, Consumer, Automotive, Medical) and Geography (N. America, Europe, APAC & ROW) Global Trends & Forecasts to - 2014 - 2020", the total System in Package (SiP) market is expected to reach $18.10 billion by 2020, growing at a CAGR of 9.57% from 2013 to 2020.

Browse 76 market data tables, 59 figures spread through 277 pages and in-depth TOC on “System in Package (SIP) Market”.

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System in Package (SiP) is an arrangement of multiple active electronic components of different functionalities, assembled in a single unit that provides multiple functions associated with the system or sub-system. The growing demand for miniaturization and higher functionality at reduced production costs has led to the development of System in Package (SiP) solutions. SiP can be realized by the horizontal tiling or vertical stacking of two or more similar or dissimilar bare die or packaged chips.

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The report discusses the major markets by packaging technology, packaging type, interconnection technology, major applications, and geography for SiP market. The packaging technology comprises 2D IC packaging, 2.5D IC packaging, and 3D IC packaging technologies. The packaging type encompasses major types incorporated into System in Package (SiP), namely, BGA (Ball Grid Array), Surface mount package, Pin Grid Array (PGA), Flat Package, and Small Outline Package (SOP), among others. The interconnection technology segment of the report comprises flip-chip and wire bond technologies. With large number of benefits, the SiP market is gaining increased visibility in a variety of applications with most prominent ones being the consumer electronics and communications segment. The report provides detailed analysis of the current market scenario and estimation till the year 2020.

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The advance packaging has given a rise to innovative safety systems in automotive and transportation sector which will drive the System in Package (SiP) market; for example, Local Interconnect Network (LIN) solutions within the vehicle for operating the devices was introduced by Atmel Corporation (U.S.). In the overall System in Package (SiP) market, the consumer electronics sector will be the highest revenue generator and lead the market from the demand side. Semiconductor industry has a trend of outsourcing advance packaging and testing services, in which, most of the players are from the Asia-Pacific region.

Some of the key players in this market include Amkor Technology (U.S.), ASE Global (Taiwan), Powertech Technology (Taiwan), STATS ChipPAC (Singapore), ChipMOS Technologies (Taiwan), Fujitsu Semiconductor Limited (Japan), Siliconware Precision Industries Co., Ltd. (Taiwan), InsightSiP (France), Freescale Semiconductor Inc. (U.S.), Wi2Wi Inc.(U.S.), and Nanium S.A. (Portugal).

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