According to a new market research report “Thermal Interface Pads & Material Market by Type (Phase Change Material, Thermal Grease, Thermal Pads), Products (MOSFET, Thyristor, IGBT), Application (Consumer Electronics, Telecom Equipment, Power Supply Units) - Forecast to 2020”, published by MarketsandMarkets, the total thermal interface pads & material market is expected to reach $1379.02 million by 2020.
Browse 80 market data tables and 51 figures spread through 136 pages and in-depth TOC on “Thermal Interface Pads & Material Market - Forecast to 2020"
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The thermal interface pads & material market comprises products used for transferring heat from electronic components to heat sinks in a wide range of electronic applications in different industries. Thermal interface pads & materials are widely used in consumer electronics, telecom equipment, power supply units, aerospace, and other industries. The global market for thermal interface pads & materials is expected to reach $1379.02 Million by 2020, at a CAGR of 8.47% from 2015 to 2020.
This report aims to provide a bird’s eye-view of the entire thermal interface pads & materials market with detailed market segmentations, combined with the qualitative analysis of the various classifications done on the basis of type, product, application, and geography. The market has been estimated and forecasted till 2020 to provide a glimpse into its growth prospects and potential.
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The report segments the thermal interface pads & material market on the basis of type, product, application, and geography. Furthermore, it estimates and forecasts the market, along with analyzing various trends in the same. The geographical analysis contains an in-depth classification of the market into the Americas, Europe, and APAC, which comprise the major regions pertaining to the said market. These regions have been further split into the major countries which comprise the market for this product. Furthermore, North America has been segmented into the U.S., Canada, and Mexico; Europe comprises U.K, Germany, France, France, Italy, and Spain; APAC comprises Japan, China, South Korea, and India; and the ROW region comprises the Middle-East, Africa, and Latin America. The sections and the sub-segments in the report include the drivers, restraints, opportunities, and current market trends; and the technologies expected to revolutionize the industry.
The thermal interface pads & materials market has been segmented based on application into consumer electronics, telecom equipment, power supply units, and others. The market has also been segmented based on type into phase change material, thermal pads, thermal grease, and others. Furthermore, the market has been segmented on the basis of product into MOSFET, Thyristor, IGBT, and others.
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This report focuses on providing an insight into the overall thermal interface pads & material market, with detailed market segmentations, combined with the qualitative analysis of each and every aspect of classification on the basis of type, product, application, and geography. The said market has been estimated and forecasted till 2020, to identify the key revenue pockets for the same.
The global thermal interface pads & material market is expected to reach $1379.02 Million by 2020, at an estimated CAGR of 8.47%. The market for PCM materials is expected to grow at a high CAGR during the forecast period.
Some of the prominent companies in this thermal interface pads & material market include 3M (U.S.), Dow Corning (U.S.), Parker Chomerics (U.S.), and Laird Technologies (U.K.).
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