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Semiconductor and IC Packaging Materials Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2013 – 2019

Semiconductor and IC Packaging materials are used to guard the electronics components like IC’s and semiconductors from corrosion and external impact. These materials are used along with the several advanced packaging technologies for the packaging of IC’s and semiconductors. The Spackaging material performs the final stage of semiconductor device fabrication by placing the boards or dies inside the protective package to provide the pins or connectors for connection.


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In the span of four years i.e. from 2010 to 2014, product development was the main growth approach adopted by the IC’s and semiconductor packaging materials industry. In the first six months of 2013, the Henkel AG has completed four products. Further, the company was acquired by Hitachi Chemical Co. Ltd., and the expansion has been done by Henkel AG & Company and Hitachi Chemical Co. Ltd. collectively. Atotech Deutschland and Sumitomo Chemical Co. Ltd. are the further key participants in the development activities during this period. The other active players in market development of IC’s and semiconductor packaging materials are Indium Corp. and Shinko Electric Industries Co. Ltd.


Some of the factors driving the growth of semiconductor & IC packaging materials market include increase in the research and development efforts to make the electronic packaging materials highly resourceful, the enormous demand from the electronic component companies due to amplified population that finds electronic packaging materials useful in a myriad of applications. The materials are well perceived in various dominant end-user markets in the last few decades, and are expected to be used for diverse applications in the future


The semiconductor & IC packaging materials market is segmented on the basis of its types which include solder balls, organic substrates, leadframes, bonding wires, encapsulation resins, die attach materials, ceramic packages, thermal interface materials and others (mold compounds). These materials are produced with numerous types of packaging technologies which includes SP, power QFN, DFN and GA. Organic substrate segment contributes the most in the global market and is extensively used as foundation materials for the packaging of Integrated Circuits (IC’s) and semiconductors. The bonding wire segment mostly of gold has been generally used as packaging materials, but recently there has been a change towards copper bonding wires. Encapsulation resin segment is comparatively new types of packaging materials for IC’s and semiconductors and due to this the segment is expected to grow aggressively in the next five years. In addition, the market could be segmented on the basis of geography which includes NorthAmerica, Europe, Asia-Pacific and RoW.



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Some of the key players that are dominating this market are Alent PLC, Kyocera Chemical Co. Ltd., Hitachi Chemical Co. Ltd., LG Chemical Ltd., Basf SE, Sumitomo Chemical Co. Ltd., Henkel Ag & Company, Mitsui High-Tec Inc., Tanaka Holdings Co. Ltd. and Toray Industries Corporation among others.


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